Rate My Professor Bahgat Sammakia

Bahgat G. Sammakia is a SUNY Distinguished Professor of Mechanical Engineering in the field of Engineering at the State University of New York at Binghamton. He received his BS in Mechanical Engineering from the University of Alexandria in Egypt, followed by MS and PhD degrees in Mechanical Engineering from the University at Buffalo, and completed a postdoctoral fellowship at the University of Pennsylvania. Sammakia's professional career began at IBM Corporation's Microelectronics Division, where he served from 1984 to 1998 as a Senior Technical Staff Member and manager of organic electronics packaging research and development. Joining Binghamton University in 1998, he advanced to Distinguished Professor and has held key leadership positions, including founding director of the New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP) since 2003, director of the NSF Industry/University Cooperative Research Center for Energy-Smart Electronic Systems (ES2) since 2011, and Vice President for Research from 2011 to August 2025. Additionally, he was Interim President of SUNY Polytechnic Institute from November 2016 to June 2018.

His research specializations encompass heat transfer, electronics packaging, thermal management of data centers, energy optimization, flexible electronics, and heterogeneous integration. With over 350 publications and 40 patents, his work has garnered more than 11,000 citations. Notable publications include the book Energy Efficient Thermal Management of Data Centers (2012, co-authored with Y. Joshi et al.), Buoyancy-induced flows and transport (1989), and "Chip to Facility Ramifications of Containment Solution on IT Airflow and Uptime" (2016) in IEEE Transactions on Components, Packaging and Manufacturing Technology. Sammakia has received prestigious awards such as the ASME Heat Transfer Memorial Award (2020), ITherm Achievement Award (2010), and SUNY Chancellor’s Award for Excellence in Scholarship and Creative Activities. He is a Fellow of the American Society of Mechanical Engineers (ASME), IEEE, and the National Academy of Inventors. His influence extends to editorial roles as Editor-in-Chief of the Journal of Electronic Packaging (2001-2013) and member of the Board of Directors of the Research Foundation of the State University of New York.