Johns Hopkins, founded in 1876, is America's first research university and home to nine world-class academic divisions working together as one university.

Salary: $60,000-$100,000 a year

Johns Hopkins University: Whiting School of Engineering: Office of Research and Translation

Description

PREP Research Associate
CHIPS Funded Project.

This position is part of the National Institute of Standards and Technology (NIST) Professional Research Experience Program (PREP). NIST recognizes that its research staff may want to collaborate with researchers at academic institutions on specific projects of mutual interest and, therefore, requires those institutions to be recipients of a PREP award. The PREP program involves staff from a wide range of backgrounds conducting scientific research across various fields. Individuals in this position will perform technical work supporting the collaboration's scientific research.

Research Title:

Research Engineering Technician (CHIPS Project: Nondestructive defect detection metrology for advanced semiconductor packaging)

The work will entail:

The candidate will join a multidisciplinary team of scientists working to advance nondestructive defect detection metrology for advanced semiconductor packaging by developing reference artifacts and benchmark datasets. The candidate will also contribute to sample preparation and to making destructive (e.g., FIB/SEM) and nondestructive measurements (e.g., XCT). The candidate will contribute to the development of reference artifacts. The candidate may contribute to designing CAD models, running X-ray computed tomography (XCT) simulations, and performing XCT reconstructions to generate datasets. The candidate will support the development of a Python script or package to automate these processes as needed. The datasets will be used to evaluate defect detection and image segmentation algorithms, including those based on deep learning principles. The incumbent will analyze the resulting measurements, perform image processing, and extract meaningful information to support the research goals outlined in the experiment plan. They will organize the measured and analyzed datasets for publication and communicate with the team.

U.S. Citizen Preferred

Key responsibilities will include but are not limited to:

• Prepare samples for focused ion beam or scanning electron microscopy measurements
• Make X-ray computed tomography or laminography measurements
• Design 3D models for simulation, run XCT simulations, carry out XCT reconstruction, and execute image analysis.
• Organize and prepare data sets for publication.
• Presenting results at internal meetings and occasional meetings with external stakeholders.
• Ensuring that results, protocols, software, and documentation have been archived or otherwise transmitted to the larger organization.

Qualifications

• A bachelor's degree in physics, engineering, or a related discipline.
• At least 5 years of relevant experience.
• Experience with XCT measurements, reconstruction, and image analysis. Experience with XCT simulation is a plus.
• Experience with sample preparation, FIB, and SEM.
• Experience with the image segmentation process using commercial software or an open-source tool.
• Strong oral and written communication skills.
• Able to quickly learn and adapt to new fields or techniques

Johns Hopkins, founded in 1876, is America's first research university and home to nine world-class academic divisions working together as one university.

Salary: $60,000-$100,000 a year

Johns Hopkins University: Whiting School of Engineering: Office of Research and Translation

Description

PREP Research Associate
CHIPS Funded Project.

This position is part of the National Institute of Standards and Technology (NIST) Professional Research Experience Program (PREP). NIST recognizes that its research staff may want to collaborate with researchers at academic institutions on specific projects of mutual interest and, therefore, requires those institutions to be recipients of a PREP award. The PREP program involves staff from a wide range of backgrounds conducting scientific research across various fields. Individuals in this position will perform technical work supporting the collaboration's scientific research.

Research Title:

Research Engineering Technician (CHIPS Project: Nondestructive defect detection metrology for advanced semiconductor packaging)

The work will entail:

The candidate will join a multidisciplinary team of scientists working to advance nondestructive defect detection metrology for advanced semiconductor packaging by developing reference artifacts and benchmark datasets. The candidate will also contribute to sample preparation and to making destructive (e.g., FIB/SEM) and nondestructive measurements (e.g., XCT). The candidate will contribute to the development of reference artifacts. The candidate may contribute to designing CAD models, running X-ray computed tomography (XCT) simulations, and performing XCT reconstructions to generate datasets. The candidate will support the development of a Python script or package to automate these processes as needed. The datasets will be used to evaluate defect detection and image segmentation algorithms, including those based on deep learning principles. The incumbent will analyze the resulting measurements, perform image processing, and extract meaningful information to support the research goals outlined in the experiment plan. They will organize the measured and analyzed datasets for publication and communicate with the team.

U.S. Citizen Preferred

Key responsibilities will include but are not limited to:

• Prepare samples for focused ion beam or scanning electron microscopy measurements
• Make X-ray computed tomography or laminography measurements
• Design 3D models for simulation, run XCT simulations, carry out XCT reconstruction, and execute image analysis.
• Organize and prepare data sets for publication.
• Presenting results at internal meetings and occasional meetings with external stakeholders.
• Ensuring that results, protocols, software, and documentation have been archived or otherwise transmitted to the larger organization.

Qualifications

• A bachelor's degree in physics, engineering, or a related discipline.
• At least 5 years of relevant experience.
• Experience with XCT measurements, reconstruction, and image analysis. Experience with XCT simulation is a plus.
• Experience with sample preparation, FIB, and SEM.
• Experience with the image segmentation process using commercial software or an open-source tool.
• Strong oral and written communication skills.
• Able to quickly learn and adapt to new fields or techniques