Resource-saving design and manufacturing of Printed Circuit Boards
About the Project
Challenge: In the UK we each create a huge amount of electronic waste—the second highest in the world. A large and critical component of Waste Electrical and Electronic Equipment (WEEE) comprises of printed circuit boards (PCBs). The typical substrate for PCB manufacturing and lamination (i.e., FR4) alone contributes ~70% of waste and poses major environmental challenge as it contains toxic substances such as brominated flame retardants (BFR), and non-metallic materials. The wastage of highly purified metals (copper, silver, nickel, etc.), which have limited reserves, also raise the concern related to sustainability. Manufacturing of PCBs using lesser materials could be potential solution for above challenges.
Proposed work: The vision of this project is to develop eco-friendly PCBs through additive manufacturing and provide a lasting solution for the e-waste generated by the conventional PCB during its manufacturing and the end-of-life (EOL). When the PCB reaches its EOL, the layers of ink, adhesive, and polymers will degrade naturally, and the electronic components will be available for reuse. This work proposes a resource saving way of manufacturing of PCBs through the additive layer manufacturing (ALM). It will essentially investigate the following.
- Preparation and characterisation of various degradable materials needed to realise sustainable PCBs.
- Smart Design and Additive layer manufacturing (ALM) for future PCBs.
- Sensor integration with sustainable PCB.
- Sustainability and life cycle assessment
Expected outcome: The outcome of this work will be the savings of resource and the resource saving manufacturing of printed circuit boards.
- Saving of resource materials like copper, silver, nickel, etc.
- Saving of water resource
- Saving of energy resource
- Lasting solution for the E-Waste
The ideal candidate for this PhD position should have some knowledge of electronic circuit and material characterisation.
Funding Notes
there is no funding for this project
References
Chakraborty, Moupali, Jeff Kettle, and Ravinder Dahiya. "Electronic waste reduction through devices and printed circuit boards designed for circularity." IEEE Journal on Flexible Electronics 1.1 (2022): 4-23.
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