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5.04/23/2026

Passionate about student development.

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About Hongseok

Hongseok Choi is an Associate Professor of Mechanical Engineering at Clemson University in the College of Engineering, Computing and Applied Sciences. He joined the Department of Mechanical Engineering as an Assistant Professor in August 2013, following his role as an Assistant Scientist at the Nano-Engineered Materials Processing Center at the University of Wisconsin-Madison. Choi obtained his Ph.D. in Mechanical Engineering from the University of Wisconsin-Madison in 2007, an M.S. in Mechanical Engineering from the same university in 2002, and a B.S. in Mechanical Engineering from Yeungnam University in South Korea in 1997. His expertise includes solidification nanoprocessing, micro/nano sensors, ultrasonic joining, laser materials processing, and additive manufacturing. As director of the Clemson Advanced Manufacturing & Materials Processing (CAMMP) Laboratory, Choi leads interdisciplinary research that integrates experimental studies and physical modeling of advanced manufacturing processes. The lab is recognized for pioneering the manufacturing of large volumes of metal matrix nanocomposites through a state-of-the-art liquid-based process and for developing smart manufacturing systems with integrated micro/nano sensor networks for self-diagnostic capabilities. His research interests encompass scalable nanomanufacturing of bulk nano-engineered materials for high performance and energy efficiency, smart micro/nanosystems for intelligent micro/nanomanufacturing technologies, laser-based micro/nano materials processing, and micro/nano additive manufacturing, with applications to high-performance lightweight materials via processing-structure-property relationships.