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Prof. Dr.-Ing. Hussam Amrouch (*1985) is Professor (W3) heading the Chair of AI Processor Design at the Technical University of Munich (TUM), within the School of Computation, Information and Technology. He also heads Brain-inspired Computing research at the Munich Institute of Robotics and Machine Intelligence and serves as head of the Semiconductor Test and Reliability group at the University of Stuttgart. Amrouch earned his Ph.D. (Dr.-Ing.) with summa cum laude distinction from the Karlsruhe Institute of Technology in 2015. That year he founded and led the Dependable Hardware research group at KIT until 2022. In 2020 he was appointed Junior Professor at the University of Stuttgart, heading the Chair of Semiconductor Test and Reliability. He was appointed to his current W3 professorship at TUM in 2023 and holds a Research Scholar position (2020–2025) at the University of Nebraska-Lincoln.
His research focuses on ultra-efficient embodied AI, reliable and secure designs using emerging technologies, and cryogenic circuits for quantum computing. Amrouch has received ten HiPEAC Paper Awards and three best paper award nominations at DAC and DATE conferences. He serves as Editor for Nature Scientific Reports and as a reviewer for journals including Nature Electronics and Nature Communications. He has delivered 13 tutorials and 27 invited talks, including two keynotes, and organized 12 special sessions at major conferences such as DAC, DATE, ICCAD, and ASP-DAC. Amrouch is a member of the Board of Directors of the Graduate School on Intelligent Methods for Test and Reliability at the University of Stuttgart, where he has led six projects. Key publications include works on printed temperature sensor arrays (Nature Scientific Reports, 2022), ferroelectric programmable majority gates (IEDM, 2022), and hardware/software co-design for hyperdimensional computing (IEEE Transactions on Computers, 2023).
ETH Zurich and TUM lead Europe's charge in semiconductor innovation with groundbreaking 7nm AI chip tape-outs, boosting sovereignty, education, and efficiency in higher ed.
TUM unveils EU's first 7nm university-designed AI chip, boosting privacy, efficiency, and sovereignty. Explore technical details, applications, and higher ed impacts.
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