Job Details

Posting Number: PG194604EP

Working Title: CLAWS Packaging Engineer

Anticipated Hiring Range: Commensurate with Education and Experience

Work Schedule: Monday - Friday, 8am - 5pm

Job Location: Raleigh, NC

Department: Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS)

About the Department

North Carolina State University is leading the charge as the recipient of a $39.4 million award from the Department of Defense to establish the regional Microelectronics Commons regional innovation hub, Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS). This initiative, part of the larger $238 million investment through the Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act, aims to revolutionize the field of wide bandgap semiconductors.

Essential Job Duties

We are seeking an experienced semiconductor device Packaging Engineer to join our research foundry team, supporting the development of advanced RF, Power, and Photonic devices and integrated circuits.

Key Responsibilities:

• Lead packaging of wide bandgap semiconductor devices (30%)
  • RF devices including HEMTs and MMICs
  • High power electronic devices including HEMTs, FETs, and diodes
  • Visible spectrum optoelectronic devices and Photonic Integrated Circuits.
• Packaging Design and Assembly Workflows (25%)
• Process Integration (25%)
• Cross-functional Collaboration (20%)