Hybrid Co-packaging of a PIC with Miniature Free-Space Optical Elements

About the Project

Integrating photonic integrated circuits (PICs) with miniature free-space optical elements is crucial for creating next-generation functional optoelectronic modules that can reliably operate in real-world conditions. Achieving precise alignment and robust bonding of tiny components like fast axis collimators (FACs) and fibre array units (FAUs) to the PIC requires sub-micron positional accuracy, presenting significant technical challenges. However, mastering this capability will unlock the potential to develop innovative proof-of-concept demonstrators and enable low-volume production runs of advanced photonic assemblies. This represents a major milestone in integrated photonic design and manufacturing.

This multidisciplinary, collaborative project encompasses manufacturing, prototyping, leveraging mechanical engineering, electronic engineering, embedded software and photonics expertise.

This project is funded under “QUB Collaborative Studentships” program. This is a collaborative project between Queen’s and Thales. The student will work closely with the industrial partner and Advanced Manufacturing Innovation Centre (AMIC). Fully covered for eligible UK and ROI nationals, and EU nationals with settled status in the UK (subject to Department for the Economy (DfE) criteria).