R&D Test Engineer – 3D Integration and Interconnect Characterization and Automation

and execute electrical characterization activities for advanced 3D integration technologies and interconnect structures. You will work at the intersection of test structure design, modeling, simulation, experimental characterization and automated parametric testing. In close collaboration with technology and integration teams, you will translate technical questions into well-designed experiments, develop appropriate measurement strategies and generate reliable data to support technology development and evaluation. Beyond supporting existing activities, you will help shape the future of this domain by increasing measurement throughput, automating workflows and exploring how AI can improve experiment design, test structure generation and data analysis. You will work closely with researchers, process integration engineers and project teams to translate technical questions into appropriate measurement approaches and reliable characterization results. Your responsibilities include: Definition and optimization of design of experiments (DoEs), translating technology and characterization questions into efficient experimental plans Use simulation results and experimental feedback to refine and validate subsequent experiments. Collaborating with process, integration teams and CAD engineers to define test requirements, assess results and troubleshoot measurement or characterization challenges. Execution of hands-on measurements on wafer-level test structures, understand anomalies and test hypotheses. Support of the fully automated parametric test activities for a broad range of internal and external customers. Automate characterization workflows to improve measurement throughput and reproducibility. Presenting and discussing the high-quality results to imec partners by actively interacting with them; where applicable also publishing them to top-tier scientific conferences and journal papers Sharing your technical expertise with colleagues and supporting the transfer of knowledge within the team. Implement approaches to use AI and computational methods for DoE optimization, automated test structure generation, measurement planning and data analysis. What we do for you We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow. We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth. We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits. Who you are A master's degree in electrical engineering, electronics, physics or a related technical field. Candidates with a relevant PhD or equivalent practical experience are also welcome. Experience in electrical characterization, semiconductor testing or measurement instrumentation. A solid understanding of electrical parameters and measurement principles, particularly capacitance measurements and the characterization of IC interconnect structures. An analytical mindset and an interest in understanding the physical and technological factors behind observed electrical behaviour. The ability to work independently while collaborating effectively with multidisciplinary research and engineering teams. Good communication skills and the ability to document and explain technical results clearly. A proactive, precise and quality-conscious working style. Proficient in written and spoken English Being a team player What will strengthen your application Experience with 3D integration and/or advanced semiconductor packaging. Familiarity with TSVs, hybrid bonding, microbumps, metal interconnects or metal redistribution layers. Practical experience with wafer probing, semiconductor parameter analysers, LCR meters or other electrical characterization instrumentation. Knowledge of capacitance modelling, parasitic extraction or the interpretation of electrical test structures. Experience developing measurement setups, defining test methodologies or automating measurement workflows. Familiarity with semiconductor process integration and the relationship between process characteristics and electrical performance. Familiarity with CAD design