workloads under power, thermal and system technology co-optimisation (STCO) constraints. The remit spans on-chip integration through to board-level integration in heterogeneous systems, supported by hands-on implementation experience across digital VLSI, embedded systems, low-level firmware, and where relevant, high-speed PCB design.
We are interested in candidates with experience of designing, implementing and validating digital integrated circuits, subsystems or board-level integrated platforms, including participation in silicon tape-outs through industrial product development or academic multi-project-wafer programmes (e.g. Europractice, eFabless, TinyTapeout), and substantive high-speed PCB design and integration where the heterogeneous-integration boundary extends to board level. Experience that combines architectural decision-making with hands-on implementation is particularly welcomed; expertise spanning sensor integration and data conversion, processor or accelerator architecture, debug and telemetry, hardware-software co-design, or low-level firmware development is valued.
Why this role is distinctive:
- You will have the opportunity to build an independent academic research programme.
- You will have access to a major national semiconductor initiative through CHIMES².
- You will work within a growing ecosystem of industrial and government partners shaping the UK’s semiconductor capability.
The successful candidate will play a significant role in shaping the future of Sheffield’s semiconductor and integrated systems curriculum across undergraduate and postgraduate programmes, including teaching in microelectronic systems design, computer and embedded systems architecture, and verification and test strategies.
This post offers meaningful leverage on UK semiconductor capability through CHIMES² and the national heterogeneous integration agenda, demonstrator and co-design programmes, semiconductor curriculum renewal, industrial engagement, and training of the next generation of analogue and mixed-signal designers; these are areas in which the successful candidate could make substantial national contributions over a decade and beyond.
What you’ll have access to:
You will be supported in establishing an internationally competitive research programme through access to:
- An experienced microelectronics research group, with industry-standard EDA infrastructure (Cadence, Siemens EDA, Synopsys), chip design and characterisation facilities, and opportunities for engagement with the CHIMES² industrial partner network for collaboration, translation and impact.
- Established pathways to MPW fabrication through Europractice and other national and international semiconductor initiatives.
- Pathways to compete for doctoral funding through School-funded studentships, Doctoral Landscape Awards, CHIMES² doctoral training activities and wider UKRI-funded programmes.
- School-level mentoring and career-development support, together with the University’s Academic Career Pathway and its routes to promotion.
We welcome applications from candidates returning to work after a career break, and from candidates interested in part-time/job-share working.
We offer benefits, including: competitive annual leave entitlement, a generous pension scheme, flexible working, development and wellbeing opportunities, retail discounts, and more. You can find out more at sheffield.ac.uk/jobs/benefits.
Information for international candidates and support is available here.
Relocation support is available for candidates moving to Sheffield to take up the post (subject to eligibility and University policy). https://sheffield.ac.uk/jobs/induction/removal-expenses
We believe diversity in all its forms delivers greater impact through research, teaching and student experience.
