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PostDoc position on Wafer Bonding Physics for 3D Chip Integration

Closes:

Salary: €3,706 – €5,760 per month

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Deadline: 17 Nov ’26   Published: [contact details available in the full listing]

Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked and interconnected to create faster, more compact and more energy-efficient semiconductor devices. However, the detailed mechanisms that determine bonding quality are still not sufficiently understood. In particular, the interplay between surface properties, wafer morphology, and the resulting bonding performance is still largely optimized empirically.

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