Full time, fixed term level A or B for 2-3 years with the possibility of extension Join the School of
Electrical and Computer Engineering and contribute to pioneering research redefining microelectronics and semiconductor technology Base Salary Academic Level A $117,936-125,896 p.a or Academic Level B $133,533 - $157,381 p.a. + 17% superannuation About the opportunity The School of Electrical and Computer Engineering is seeking a highly motivated Postdoctoral Research Associate/Fellow (Level A or Level B) to contribute to a research project focused on the development of advanced microwave technologies for microelectronics and radio frequency system-in-package. Working closely with the Chief Investigator, industry partners and research collaborators, you will contribute to the design, development and integration of next-generation microwave and radio frequency systems. This role offers the opportunity to work at the forefront of semiconductor packaging, heterogeneous integration and high-frequency imaging technologies, while contributing to impactful research outcomes and industry engagement. Your key responsibilities will be to: design and develop advanced semiconductor packaging and heterogeneous integration solutions for microwave, millimetre-wave and terahertz applications, undertake electromagnetic modelling, circuit simulation and optimisation using industry-standard software tools, develop, integrate and experimentally validate high-frequency RF, millimetre-wave and terahertz hardware systems and imaging platforms, conduct laboratory testing, characterisation and performance evaluation of electronic, RF and semiconductor packaging technologies, work collaboratively with academic and industry partners to deliver project milestones and research outcomes, contribute to student supervision, research publications, technical reports, presentations and other scholarly outputs. About you The University values courage and creativity; openness and engagement; inclusion and diversity; and respect and integrity. As such, we are seeking a Postdoctoral Research Associate/Fellow who has: a PhD in Electrical Engineering, Electronic Engineering, Microelectronics, RF Engineering or a closely related discipline, demonstrated experience in advanced semiconductor packaging, heterogeneous integration and high-frequency RF, millimetre-wave or terahertz technologies, expertise in electromagnetic modelling and simulation using tools such as Keysight ADS, CST Studio Suite and/or Ansys HFSS, experience designing, integrating and validating RF hardware, semiconductor devices, antennas or related electronic systems, strong analytical, communication and problem-solving skills, with the ability to work independently and collaboratively, a demonstrated ability to contribute to high-quality research outputs and engage effectively with research and industry stakeholders. To be considered for appointment at Level B, you will also demonstrate: extensive experience in advanced semiconductor packaging technologies, including bare-die integration, antenna-in-package (AiP), system-in-package (SiP) or related approaches, experience developing and integrating millimetre-wave and/or terahertz hardware systems and imaging technologies, advanced capability in high-frequency electromagnetic design, modelling and system-level integration, experience leading complex hardware development, experimental validation and technical problem-solving activities, a strong publication record and demonstrated contribution to successful collaborative research projects, experience supervising or mentoring research students and contributing to project leadership activities. Pre-employment checks and declarations Your employment is conditional upon the successful completion of all pre-employment or background checks required for the role in terms satisfactory to the University. Also, to meet the University's obligations under the National Higher Education Code to Prevent and Eliminate Gender-Based Violence you will be asked to declare if you have been investigated for, or found to engaged in, sexual harm or gender-based violence in the course of previous employment or in a legal process. Similarly, your ongoing employment is conditional upon the satisfactory maintenance of all relevant clearances and background check requirements. If you do not meet these conditions, the University may take any necessary step, including the termination of your employment. EEO statement At the University of Sydney, our shared values are trust, accountability and excellence and we strive to be a place where everyone can thrive. We are committed to creating a University community that thrives through diversity and reflects the wider community that we serve. We deliver on this through our commitment to diversity and inclusion , evidenced by our people and culture programs, as well as key strategies to increase participation and support the careers of Aboriginal and Torres Strait Islander People , women , people living with a disability , people from culturally and linguistically diverse backgrounds , and those who identify as LGBTQIA+ . We welcome applications from candidates from all backgrounds. We are proud to be recognised as an Australian Workplace Equality Index (AWEI) Platinum Employer. Find out more about our work on diversity and inclusion . How to apply Applications (including a cover letter, CV, and any additional supporting documentation) can be submitted via the Apply button at the top of the page. For employees of the University or contingent workers, please login into your Workday account and navigate to the Career icon on your Dashboard. Click on USYD Find Jobs and apply. For a confidential discussion about the role, or if you require reasonable adjustment or any documents in alternate formats, please contact Rebecca Astar or Cherie Goodwin, Recruitment Operations by email to recruitment.sea@sydney.edu.au © The University of Sydney The University reserves the right not to proceed with any appointment. Click to view the Position Description for this role. Applications Close Wednesday 02 December 2026 11:59 PM
