Research Engineer (Optical Interconnects & Photonic Packaging (Process and Testing))

Job Description

The Department of Electrical and Computer Engineering (ECE) at the National University of Singapore (NUS) is seeking a Research Engineer to support the development of a detachable fiber array unit (FAU) for co-packaged optics (CPO) systems. The role will focus on process and/or testing. Candidates will contribute to the design, fabrication, assembly, testing, and validation of flexible optical coupling structures and standardized optical interfaces for FAU integration in CPO systems. The work will be closely linked with simulation-driven design and optimization using tools such as ANSYS Multiphysics and/or COMSOL Multiphysics.

Responsibilities will include:

1. Fabrication & Process Development
   • Fabrication of the FAU with high V-groove pitch accuracy and uniform array flatness.
   • Fabricate optical coupling configurations, including vertical and/or edge coupling.
   • Fabricate mechanically constrained FAU interfaces using precision-defined contactor-target geometries.
   • Optimize low-expansion adhesive systems that preserve optical attachment.
2. Testing & Validation
   • Validate FAU fiber-capacity performance by examining array pitch accuracy, fiber placement repeatability, and coupling uniformity.
   • Characterize fabricated optical coupling samples by measuring beam profile, coupling efficiency, insertion loss, return loss, and misalignment tolerance.
   • Perform mechanical characterization to study FAU alignment stability, including contact deformation, preload response, and positional repeatability during repeated engagement.
   • Conduct thermal and reattachment-focused validation by examining drift over thermal cycles.
3. Project Management & Collaboration
   • Contribute research milestones in alignment with project objectives and timelines.
   • Support technical reports, publications, and presentations for both academic and industry audiences.
4. Innovation & Intellectual Property
   • Assist in patent filings, technology disclosures, and commercialization efforts.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Physics, Materials Science, Optical Engineering, Photonics or its equivalent from a reputable University/Institute is preferred, or equivalent related experience.
• Experience in fabrication, assembly, characterization, metrology, optical testing, reliability testing, microelectronics, semiconductor packaging, or photonic packaging would be advantageous.
• Experience with optical interconnects, fiber arrays, fiber-to-chip coupling, FAU assembly, precision alignment, or CPO-related packaging would be a strong advantage.
• Familiarity with simulation-driven design workflows, including ANSYS Multiphysics, COMSOL Multiphysics, or equivalent tools, would be advantageous.
• Self-driven, collaborative, and able to communicate effectively through technical writing and presentations.
• Open to Fixed Term Contract.