Research Engineer (Optical Interconnects & Photonic Packaging (Simulation/Modeling))

Job Description

The Department of Electrical and Computer Engineering (ECE) at the National University of Singapore (NUS) is seeking a Research Engineer to support the development of a detachable fiber array unit (FAU) for co-packaged optics (CPO) systems. The role will focus on simulation and modeling. Candidates will contribute to the design, development, and validation of flexible optical coupling structures and standardized optical interfaces for FAU integration in CPO systems, using tools such as ANSYS Multiphysics and/or COMSOL Multiphysics. This is an exciting opportunity to work at the forefront of semiconductor photonics and advanced optical packaging in close collaboration with industry partners and academic researchers.

Responsibilities will include:

1. Design
   • Design FAU array geometry.
   • Develop optical coupling schemes as a unified optical-interface strategy, including vertical coupling and edge coupling.
   • Design FAU mechanical alignment structures that provide kinematic constraint in x- and y-axes and angular orientation.
   • Select and optimize low-expansion adhesives that maintain optical alignment stability and allow corrective reattachment.
2. Modeling & Simulation
   • Determine the required FAU capacity model, including wavelength tolerances, array flatness, thermo-optical, and thermo-mechanical interactions affecting optical alignment.
   • Simulate combined optical coupling behavior by evaluating coupling-element interfaces for vertical coupling and edge coupling.
   • Use mechanical modeling to simulate FAU alignment behavior, in particular kinematic coupling of contactor-target pair during attachment cycles.
   • Extend thermo-mechanical-optical simulations to study temperature-driven stress, material expansion mismatch, and drift or relaxation mechanisms.
3. Project Management & Collaboration
   • Contribute research in alignment with project objectives and timelines.
   • Support technical reports, publications, and presentations for both academic and industry audiences.
4. Innovation & Intellectual Property
   • Assist in patent filings, technology disclosures, and commercialization efforts.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Physics, Materials Science, Optical Engineering, Photonics or its equivalent from a reputable University/Institute is preferred, or equivalent related experience.
• Candidate with experience in simulation and modeling for optical, mechanical, thermal, thermo-optical, or thermo-mechanical systems.
• Familiarity with tools such as ANSYS Multiphysics, COMSOL Multiphysics, Zemax, Lumerical, or equivalent simulation platforms would be advantageous.
• Experience in optical interconnects, fiber arrays, photonic packaging, semiconductor packaging, microelectronics, characterization, metrology, or reliability testing would be an advantage.
• Self-driven, collaborative, and able to communicate effectively through technical writing and presentations.
• Open to Fixed Term Contract.