University-Level Unit: College of Design and Engineering
Job Title: Senior Research Fellow [Thermo-Mechanical Simulation]
University-Level Unit: College of Design and Engineering
Faculty/Department-Level Unit: Electrical and Computer Engineering
Employee Category: Research Staff
Location_ONB: Kent Ridge Campus
Posting Start Date: 15/10/2026
Job Description
The ECE Department at NUS is seeking a Senior Research Fellow. An experienced and highly motivated Thermo-Mechanical and Thermal Simulation Researcher to drive the development and deployment of advanced modeling and simulation methodologies for next-generation semiconductor packaging technologies, including Integrated Silicon Photonics solutions. The successful candidate will play a key role in supporting 2.5D, 3D, chiplet, and heterogeneous integration programs through predictive simulation of thermo-mechanical behavior, package reliability, and manufacturing process interactions.
The successful candidate will play a dual role: In spearheading the development of advanced 2.5D, 3D, chiplet, and heterogeneous integration programs, while driving innovation and validation of next-generation technologies to enable industry-leading system scaling.
This position offers a unique opportunity to conduct cutting-edge research in thermal, mechanical, and reliability modeling, enabling the development of advanced packaging solutions for AI, HPC, datacenter, and communication applications. The researcher will work closely with leading academic researchers, industrial partners, and government-sponsored research institutions advance the scientific understanding of thermo-mechanical interactions, high-power thermal management and reliability challenges in advanced packaging systems.
Responsibilities will involve:
1. Thermal and Thermo-Mechanical Modeling.
- Develop and execute finite element simulations (FEA) and multiphysics models to evaluate thermal and mechanical behavior of advanced semiconductor packages.
- Analyze package-level and system-level thermal performance, including heat dissipation, thermal resistance, temperature distribution, and cooling strategies.
- Model thermo-mechanical stresses arising from coefficient of thermal expansion (CTE) mismatch, package warpage, and assembly processes.
- Investigate deformation mechanisms associated with die stacking, TSV integration, hybrid bonding, underfill materials, interposers, and advanced substrate technologies.
- Provide design recommendations based on simulation-driven insights.
2. Reliability Assessment
- Establish predictive models for package reliability, including Thermal cycling, Power cycling, Solder fatigue, Die cracking, Interfacial delamination and Interconnect reliability.
- Correlate simulation results with experimental reliability test data and failure analysis findings.
3. Research and Innovation
- Develop simulation methodologies for advanced packaging challenges associated with AI accelerators, high-power processors, and heterogeneous integration.
- Evaluate emerging packaging technologies such as 3D IC stacking, Chiplet integration, Silicon interposers, Hybrid bonding, Advanced cooling solutions, Embedded bridges, and fan-out architecture.
- Generate intellectual property through patent disclosures and technical publications.
4. Leadership Impact
- Lead a critical module team to enable leadership system integration technology for 2.5D and 3D/hybrid bonding systems.
- Expanded Project Management: Acting as the primary technical interface and taking full ownership of deliverables.
- A key role in enabling the next generation of advanced packaging technologies through predictive simulation, reliability engineering, and innovative research. Your work will directly influence the development of future AI, HPC, datacentre, and heterogeneous integration platforms.
5. Key Research Areas
- Thermo-mechanical modeling of hybrid bonded structures
- AI/HPC package thermal management and advanced cooling solution design
- Chiplet/package co-design optimization
- Warpage prediction and control
- Physics-based reliability prediction
Job Requirements
Education:
- Reporting to PI Prof Yu Chen-Hua.
- Ph.D. in Electrical, Electronics, Mechanical, Chemical Engineering, Computational Engineering, Applied Physics, Material Science or its equivalent from a reputable University/Institute is preferred.
- Exceptional candidates with a Master's degree and significant industry experience will also be considered.
Experience:
- 3+ years of industrial R&D, or advanced research and development experience in semiconductor packaging, thermal engineering, reliability, or related fields.
- Candidate demonstrated experience in thermo-mechanical and thermal simulation of advanced electronic packages. Publication records in peer-reviewed journals and international conferences in advanced packaging or Silicon photonics will be a big plus.
Technical Skills:
- Strong analytical and problem-solving skills with solid knowledge of Solid mechanics, Fracture mechanics, Heat transfer, Reliability physics and Finite element analysis.
- Hands-on experience with simulation tools such as ANSYS Mechanical, ANSYS Icepak, COMSOL Multiphysics, Abaqus or equivalent FEA platforms.
- Familiarity with 2.5D/3D packaging, Chiplet integration, Hybrid bonding, TSV technologies, and Silicon Photonics.
- Experience with scripting and automation using Python, MATLAB, or similar programming languages will be a big plus.
Others:
- Proficiency in data analysis and interpretation using statistical tools and software packages.
- Excellent communication skills and the ability to work effectively in a collaborative research environment.
- Motivated and possesses effective communication skills including writing and presenting.
- Ability to present complex technical concepts to multidisciplinary audiences.
- Open to Fixed Term Contract.
Req ID: 34679