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System-Level Power and Thermal Modelling Researcher

Closes:

81

What you will do

Continued technology scaling and the integration of heterogeneous technologies are increasing the complexity of power delivery, thermal management, and energy optimization across the entire computing stack. Emerging technologies such as fine-grain 3D integration, advanced packaging, backside power delivery networks, and chiplet-based architectures require new methodologies to model and optimize system behaviour beyond the traditional chip boundary.

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