Postdoctoral Fellow

General Description

Salary: $120,000 per year

PREP Research Associate

CHIPS Funded Project.

This position is part of the National Institute of Standards and Technology (NIST) Professional Research Experience Program (PREP). NIST recognizes that its research staff may want to collaborate with researchers at academic institutions on specific projects of mutual interest and, therefore, requires those institutions to be recipients of a PREP award. The PREP program involves staff from a wide range of backgrounds conducting scientific research across various fields. Individuals in this position will perform technical work supporting the collaboration's scientific research.

Research Title:

Electronic Materials

The work will entail:

This PREP position focuses on developing on-wafer metrology for tunable dielectrics, anisotropic materials, and out-of-plane permittivity. The position requires finite element simulations, programming, network analysis, dimensional metrology, web-based programming, and other skills. The position will use on-wafer methods to develop a materials characterization technique for mmWave industry to validate the authenticity of integrated circuits.

U.S. Citizen Preferred

Key responsibilities will include but are not limited to:

• The PREP student will coordinate all stakeholder engagement to understand industries need and coordinate regular updates to solicit feedback.
• The PREP student will design, simulate, and assemble on-wafer devices for mmWave test and measurement.
• With the measurement systems integrated, the PREP student will perform all measurements and analysis on the data.
• In coordination with NIST researcher, the PREP student will develop and carry out a plan that test new materials characterization metrologies

Qualifications

• A Doctorate degree in Physics, Materials Science Engineering, or a related field.
• 2 years of relevant experience with on-wafer calibration, and materials metrology.
• Familiarity with programming in MATLAB.
• Experience with HFSS, Circuit, and Q3D.
• Strong oral and written communication skills.