Rate My Professor Sohmyung Ha

Sohmyung Ha is an Associate Professor of Electrical Engineering and Bioengineering at New York University Abu Dhabi (NYUAD), Division of Engineering, since 2016, and serves as Global Network Associate Professor of Electrical and Computer Engineering and Biomedical Engineering at NYU Tandon School of Engineering. He leads the Integrated BioElectronics Laboratory at NYUAD. Prior to academia, Ha worked as an analog and mixed-signal circuit designer in the Semiconductor Division at Samsung Electronics in Yongin, Korea, from 2006 to 2010, contributing to engineering teams for world best-selling multimedia devices, smartphones, and televisions. He returned to academia as a Fulbright Scholar.

Ha received his B.S. degree in Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 2004 (summa cum laude), and M.S. degree in Electrical Engineering from KAIST in 2006. He earned M.S. and Ph.D. degrees in Bioengineering from the University of California San Diego (UCSD), La Jolla, CA, USA, in 2015 and 2016, respectively, receiving the Engelson Best Ph.D. Thesis Award for Biomedical Engineering from UCSD's Department of Bioengineering. His research focuses on biomedical circuits and sensors for implantable and wearable applications, advancing silicon integrated technologies interfacing with biology. Targeted applications include self-powered biosensors for wearable health monitoring, subcutaneous glucose sensors for continuous diabetes monitoring, scalable high-resolution retinal prostheses, and minimally invasive brain-computer interfaces for neurological disorders such as epilepsy and Parkinson’s disease. Key publications include "Energy-Recycling Telemetry IC with Simultaneous 11.5-mW Power and 6.78-Mbps Backward Data Delivery over a Single 13.56-MHz Inductive Link" (IEEE Journal of Solid-State Circuits, accepted); "Towards High-resolution Retinal Prostheses with Direct Optical Addressing and Inductive Telemetry" (Journal of Neural Engineering, 2016); "Silicon Integrated High-Density Electrocortical Interfaces" (Proceedings of the IEEE, accepted); "Integrated Circuit and Electrode Interfaces for Non-Invasive Physiological Monitoring" (IEEE Transactions on Biomedical Engineering, 2014); and "Energy-Recycling Integrated 6.78-Mbps Data 6.3-mW Power Telemetry over a Single 13.56-MHz Inductive Link" (Symposium on VLSI Circuits, 2014). Awards include Fulbright Fellowship (2010-2012), finalist and UCSD representative for Young Investigator Award at IEEE EMBS BRAIN Grand Challenges Conference (2014), and summa cum laude from KAIST (2004).