CLAWS Packaging Engineer

CLAWS Packaging Engineer

Company:
North Carolina State University

Job Location:

Category:
Laboratory and Research

Type:
Full-Time

Join the Pack! A community with nearly 8,000 faculty and staff, and 30,000 students. NC State is one of the largest employers in North Carolina, offering a large range of career opportunities. Visit us at https://jobs.hr.ncsu.edu/.

Location: Raleigh, NC

Essential Job Duties:
We are seeking an experienced semiconductor device Packaging Engineer to join our research foundry team, supporting the development of advanced RF, Power, and Photonic devices and integrated circuits. The ideal candidate will have expertise in the development and integration of packaging processes as well as package design and assembly. The engineer will work closely with device, process, and test engineers to define interconnect strategies, perform thermal and mechanical analysis, and ensure compatibility with wafer-level processes and test infrastructure.

Key Responsibilities:

Lead packaging of wide bandgap semiconductor devices (30%)

• RF devices including HEMTs and MMICs
• High power electronic devices including HEMTs, FETs, and diodes
• Visible spectrum optoelectronic devices and Photonic Integrated Circuits.

Packaging Design and Assembly Workflows (25%)

• Specify package solutions that meet the performance requirements of new technology platforms in collaboration with CLAWS teams.
• Define scalable workflows to realize packaged discrete devices, integrated circuits, or modules.
• Participate in cross-functional design initiatives that improve performance, manufacturability, yield, or reliability.

Process Integration (25%)

• Lead the development and integration of processes in, for example, die attach, wire bonding, and encapsulation.
• Analyze package and module performance. Inform electrical, thermal, and mechanical simulations with design and characterization data.
• Troubleshoot process integration challenges related to defectivity, yield, and reliability.

Cross-functional Collaboration (20%)

• Collaborate with circuit designers, applications engineers, and product development teams to realize integrated system-level advantages.
• Stay up to date with emerging technology trends, competitive landscape, and industry benchmarks.

Other Work/Responsibilities:
The successful candidate will:

• Comply with stated workplace policies.
• Communicate results, plans, and other updates to a variety of audiences.
• Adhere to and mentor others in known best practices.
• Support CLAWS activities such as tours, meetings, and conferences.

Minimum Experience/Education:

• Ph.D. or relevant terminal degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; or
• Master's degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; with at least 5 years of experience in high power, RF, or photonics device packaging and process integration (industry or research).
• Bachelor's degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; with at least 8 years of experience in high power, RF, or photonics device packaging and process integration (industry or research).

Required Qualifications:
The successful candidate must demonstrate:

• Experience designing and implementing packaging processes for high power, RF, or photonics applications.
• Excellent communication and interpersonal skills.
• Ability to multitask and meet deadlines with moderate supervision.
• Ability to follow safe procedures for working with semiconductor packaging or fabrication equipment, chemicals, and compressed gas cylinders.
• Comfort in collaborating with students, faculty, and staff of varying experience and backgrounds.
• Eligibility to obtain clearance upon request of the US government.

Preferred Qualifications:
The successful candidate would preferably have additional experience in:

• Modeling thermal, electrical, or mechanical behavior(s) in packaged devices
• Characterization of devices and processes, including failure analysis and defect inspection.
• RF or optical signal integrity.
• Advanced packaging architectures.
• Design for reliability and reliability testing.
• MES and SPC systems.
• Statistical methods (e.g., DOE, GR&R) and tools (e.g., JMP, Minitab).
• Material specification and vendor management.

Required License or Certification:

• N/A

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