Professor of Empire Innovation, Microelectronics

Job Description

Binghamton University is nationally recognized for its leadership in microelectronic systems, semiconductors, and advanced packaging, leveraging a comprehensive ecosystem of research centers, state-of-the-art facilities, and industry partnerships. The Small Scale Systems Integration and Packaging (S3IP) center at Binghamton is a New York State Center of Excellence that houses multiple specialized centers, including the Center for Heterogeneous Integration Research in Packaging (CHIRP), Center for Advanced Microelectronics Manufacturing (CAMM), Integrated Electronics Engineering Center (IEEC), Energy Smart Electronic Systems (ES2) center, and Analytical and Diagnostic Laboratory (ADL). Our faculty members and scientists conduct sponsored research in advanced packaging, heterogeneous integration, semiconductor manufacturing and materials, flexible electronics, energy efficient electronics, and process optimization, among others. Since 1996, their research efforts have generated over $1.9 billion in economic impact for New York State, supported by collaborations with over 75 companies, including IBM, AMD, NVIDIA, Google, Intel, General Electric, Lockheed Martin, and GlobalFoundries.

The Thomas J. Watson College of Engineering and Applied Science at Binghamton University invites applications from experts in Microelectronics for a tenured faculty position at the Full Professor level. This position will carry the title of Professor of Empire Innovation, and is supported in part by SUNY's Empire Innovation Program (EIP), a key initiative to recruit and retain faculty with an established track record of research and scholarship in areas of strategic priority.

We are seeking a well-established expert who has a track record of leadership in funded research and scholarship in one or more areas of Microelectronics, including:

• Codesign for Heterogeneous Integration/Advanced Packaging: (a) EDA tools for chiplet integration or chiplet system design, including applied AI/ML techniques for microelectronics co-design, and (b) modeling for co-design with crosscutting considerations of the chiplet system architecture, thermal and mechanical issues, materials and reliability
• Digital Twinning for Semiconductor Manufacturing and Packaging (SMP): Process optimizations for SMP across lithography, device and chiplet fabrication, chiplet integration/assembly, material choices and materials synthesis for improving manufacturing yield
• Semiconductor Lifecycle Impact Reduction: Sustainable microelectronics manufacturing across the entire product lifecycle using use of eco-friendly materials, minimizing the use of hazardous chemicals (e.g., PFAS), energy-efficient processes, circular economy models, utilizing lifecycle assessment tools, and end-of-life microelectronics waste planning and management

As a Professor of Empire Innovation, the successful candidate must have an established record of securing funding from federal/state agencies and industry. They will be expected to lead in pursuing large funding opportunities from federal and state agencies besides industry partners and enhance the collaborative research ecosystem involving multiple campus units across Binghamton University. The successful hire would also help recruit and attract top talent to complement existing strengths.

Depending on the specialization and match, the successful candidate could be a tenured faculty in the Electrical and Computer Engineering (ECE) Department, the Mechanical Engineering (ME) Department, the School of Computing (CS), or the School of System Science and Industrial Engineering (SSIE).

The successful candidate will receive a comprehensive startup package including competitive salary compensation and benefits commensurate with qualifications and experience.

Requirements

• A doctoral degree in Engineering, Computer Science, or a closely related discipline
• Proven record of research leadership in cross-cutting multi-institutional collaborative teams
• Proven record of sponsored research funding from federal and state agencies
• Proven record of peer-reviewed high-impact publications
• Experience as an educator and research mentor at the undergraduate and/or graduate level

Preferred

• Significant scholarly work and contributions within one or more of the focus areas of: Codesign for Heterogeneous Integration/Advanced Packaging, Digital Twinning for Semiconductor Manufacturing and Packaging, Semiconductor Lifecycle Impact Reduction.
• Potential for leading multi-disciplinary research in Microelectronics across different departments and schools of Watson College.